
Electronic Manufacturing Capabilities
From prototyping and small scale production runs to full scale manufacturing, Lenalea Electronics Ltd is committed to providing its customers with high quality, reliable products, on time and at competitive prices.
Ultimately we provide contract manufacturing services for either through hole, surface mount or mixed technology boards. We can also manufacture cable looms and wiring assemblies or offer box build solutions if required.
PCB Manufacturing
Our IPC trained operators utilise a fully automated SMT line with all processes carried out to the highest standards.
3D automated Optical Inspection
We provide 100% 3D AOI inspection on all surface mount production. This covers all types of component defects such as missing components, alignment issues, tombstone issues, damaged components, lifted leads insufficient/excessive soldering, shorting issues and polarity issues.
Reflow Soldering
All surface mount products are reflow soldered in a computer controlled forced air convection oven. This includes small batch runs and prototypes giving you the reassurance that there will be no manufacturing related issues moving from first offs to full production.
X-Ray Inspection
X-Ray inspection is carried out, where necessary, to verify placement accuracy and soldering. This is incredibly useful on any components with hidden pads which are impossible to check using AOI alone.
Cable Assembly
We have the capabilities to offer a variety of cable assemblies to meet customer requirements. These may include basic battery cables, BNC cabling and small to medium cable looms to compliment your product, but regardless of this, all cable work is carried out to IPC 620 standard.
Box Build Assembly
We offer a full turnkey package, which can incorporate our PCB and cable assemblies and in turn, move these through a range of final build processes. This may just include adding an enclosure and testing the product. However, we have a range of additional services in our portfolio which may be of interest.
Conformal Coating
Conformal Coating is a process that is used to protect a printed circuit board from environmental factors such as heat and moisture.
This may take a variety of forms and we have experience in both full potting and spray application.
Laser Marking
Laser marking has proved to be very useful to several of our customers on their final build assemblies.
Instead of using labels that are easily removeable, we can now laser etch any form of information onto your product. Examples might include CE markings, QR codes, Bar codes and product identification information.
3D Printing
Ever needed a custom height spacer or standoff, but the cost of modifying an existing part was too high? We can design and print simple spacers and single use alignment aids, which help to both speed up the assembly process whilst reducing variation in product. This is often used where hand fitted parts were previously aligned manually, and an improvement in product consistency is required.
Broad range of solutions
Our facility is configured to suit a variety of customer requirements ranging from prototype sub-assemblies through to volume assembly regardless of whether you wish to free issue materials or require full procurement.
Although our sphere of business cannot do without high-tech technologies, we like to believe that our business depends on people, not machines. We are aware of the fact that success is created by our employees who are dedicated to providing the levels of service we offer and we try to understand each customer’s individual needs.
Lenalea Electronics Ltd has made significant investments in production equipment, enabling us to offer a range of manufacturing services. These include assembly of printed circuit boards, wiring assemblies, turnkey assembly and also testing of finished products.
Trusted by our clients

Our SMT line consists of the equipment as listed below.
Automated Speedprint Screen printer with solder paste inspection.
Europlacer iineo placement machine capable of handling Chips, Melfs, Electrolytic capacitors, SO, PLCC, QFP, TSOP, BGA, μBGA, LGA, CSP, Connectors and Odd-form surface mount devices.
Minimum size: 0.4mm x 0.2mm (01005 component).
Maximum size: 50x50mm
Minimum PCB Size: 50mmx50mm
Maximum PCB Size: 500mmx460mm

Below are some of the equipment and processes we use in-house to produce your perfect cable.
Automated cut and strip
Automated Wire Crimping
Automated boot lace ferrule termination
Custom printed label sleeving